论文部分内容阅读
阐述了LED器件的发光原理和芯片电极结构,围绕白光HB-LED的封装工艺,设计单个大功率芯片封装结构并对整个封装工艺进行研究,提出了多芯片阵列组合封装的创新理念,将其应用于多芯片阵列封装模块中。得出HB-LED封装中关键技术问题是提高外量子效率,采用高折射率硅胶减少折射率物理屏障带来的光子损失;采用高热导率的材料,减少由于封装工艺的缺陷带来的界面热阻。
The luminescent principle and chip electrode structure of LED device are described. The packaging technology of white HB-LED is designed. A single high-power chip package structure is designed and the whole packaging process is studied. An innovative idea of multi-chip array package packaging is proposed. In multi-chip array package module. It is concluded that the key technical issue in HB-LED package is to improve the external quantum efficiency, and to reduce the photon loss caused by the refractive index physical barrier by adopting high refractive index silica gel. The material with high thermal conductivity is used to reduce the interface heat caused by defects in the packaging process Resistance