微型封装是经济的、坚固的、易安装并可重复制作,又无需下填充。发明者将这种封装命名为 SLT,被认为是长期寻求的“最终微封装”,工艺简单,材料便宜,电特性良好。微型封装最主要的是材料的选择和结构设计,这种小型封装并没像大多数的倒叩封装以及微型 BGA封装一样使用普通的焊盘或焊点,取而代之的是铜焊球用于互连。由于片上没有布线,像是倒叩封装。不易熔化的铜球比焊球更需要良好的平整度和尺寸控制,但是铜球带来许多显著的优点。铜 BGA 系统更易测试,便于重复制作。与软焊料互连不同,坚硬的铜球非常容易被探针触及,夹住或插入熔融的焊点处。焊料在夹钳压力下容易变形,尤其在熔融加热条件下。另外,由于铜球用高熔点合 Micro-package is economical, sturdy, easy to install and repeatable without underfill. The inventor named this package SLT, which is considered to be the “final micro-encapsulation” sought after for a long time. The process is simple, the materials are cheap, and the electrical properties are good. Micro-package is the most important choice of materials and structural design, this small package does not like most of the flip package and micro-BGA package as the use of ordinary pads or solder joints, replaced by solder ball for interconnection . Because there is no wiring on the chip, it is like a flip chip package. Copper balls that are not easy to melt require better smoothness and size control than solder balls, but copper balls bring many notable advantages. Copper BGA system easier to test, easy to repeat production. Unlike soft solder interconnects, hard copper balls are easily touched by probes, clipped or inserted into molten solder joints. Solder easily deforms under the clamp pressure, especially under melt-heat conditions. In addition, due to the high melting point copper ball together