研究了石墨表面化学镀铜对粉末冶金法制备铜石墨材料的抗弯强度的影响，结果表明，随石墨含量变化（体积分数为６％～２０％），材料抗弯强度较未镀的提高１３．８％～１５．５％，其本质是化学镀降低材料的孔隙度。材料的抗弯强度σｂｂ与孔隙度θ符合指数关系：σｂｂ＝σｂｂ０·ｅｘｐ（－βθ），化学镀使β值升高。通过金相组织及断口形貌观察，发现化学镀使石墨分布更加均匀，且使石墨—铜的界面结合强度提高。 The effect of electroless copper plating on the flexural strength of copper-graphite materials prepared by powder metallurgy was studied. The results showed that with the change of graphite content (volume fraction of 6% ~ 20%), the flexural strength of the material increased 13 .8% ~ 15.5%, its essence is to reduce the chemical plating porosity of the material. The flexural strength σbb of the material is in exponential relation with the porosity θ: σbb = σbb0 · exp (-βθ), the electroless plating increases the β value. Through metallographic examination and fracture surface morphology observation, it was found that electroless plating made the distribution of graphite more uniform and enhanced the interface strength of graphite-copper interface.