接合质量的稳定性是要将激光软钎焊方法应用于SMT中首先要解决的关键课题。本文介绍了利用接合材料之间的热电势实时测量有效加热能量,从而实现激光软钎焊接合部质量的测量方法。并通过试验得到了有效热量同接合面积的关系,提供了一种SMT激光软钎焊接头质量的实时测量和控制方法。 The stability of bonding quality is the key issue to be solved in the application of laser soldering method to SMT. In this paper, the method of measuring the effective heating energy by using the thermoelectric force between the bonding materials is introduced in this paper to realize the measurement of the quality of laser soldered joint. Through the experiment, the relationship between the effective heat and the bonding area is obtained, and a real-time measurement and control method of SMT laser solder joint quality is provided.