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Results of an experimental and modelling study of forming processes in the AA2099 Al–Cu–Li alloy, for a wide range of temperatures, strains and strain rates, are presented. The analyses are based on tensile testing at 20 °C at a strain rate of 0.02 s-1and uniaxial compression testing in the temperature range 400–550 °C at strain rates ranging from0.001 to 100 s-1, for constant values of true strain of 0.5 and 0.9. The stability of plastic deformation and its relationship with a sensitivity of stress to strain rate are considered. The power dissipation efficiency coefficient, g(%), and the flow instability parameter, n B 0, were determined. The complex processing maps for hot working were determined and quantified, including process frames for basic forging processes: conventional forging and for near-superplastic and isothermal conditions. A significant aspect is the convergence of power dissipation when passing through the 500 °C peak.Deformation, temperature and strain-rate-dependent microstructures at 500 °C for strain rates of 0.1, 1, 10 and 100 s-1are described and analysed for the conventional die forging process frame, corresponding to 465–523 °C and strain rates of50–100 s-1.
Results of an experimental and modeling study of forming processes in the AA2099 Al-Cu-Li alloy, for a wide range of temperatures, strains and strains rates, are presented. The analyzes are based on tensile testing at 20 ° C at a strain rate of 0.02 s-1 and uniaxial compression testing in the temperature range 400-550 ° C at strain rates ranging from 0.001 to 100 s-1 for constant values of true strain of 0.5 and 0.9. The stability of plastic deformation and its relationship with a sensitivity of stress to strain rate are considered. The power dissipation efficiency coefficient, g (%), and the flow instability parameter, n B 0, were determined. The complex processing maps for hot working were determined and quantified, including process frames for basic forging processes: conventional forging and for near-superplastic and isothermal conditions. A significant aspect is the convergence of power dissipation when passing through the 500 ° C peak. Deformation, temperature and strain-rate- dependent microstructures at 500 ° C for strain rates of 0.1, 1, 10 and 100 s-1 described and analyzed for the conventional die forging process frame, corresponding to 465-523 ° C and strain rates of 50-100 s-1.