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采用化学镀法在YT15硬质合金表面制备Ni-Cu-P三元合金镀层,研究不同施镀工艺参数对镀速及镀层组织性能的影响。通过称重法测定镀层沉积速率,采用划痕法定性分析镀层与基体之间的结合强度,并利用扫描电子显微镜(SEM)分析比较不同pH值镀层表面和截面的组织形貌及成分。结果表明:最佳工艺参数为硫酸铜浓度1.25 g/L,pH=11,镀覆温度90℃,镀速为0.61 g/m2·min,镀层均匀致密,主要成分为Ni和Cu,镀层与基体的结合紧密,与焊锡浸润性良好,可焊性较强。
The electroless Ni-Cu-P ternary alloy coating was prepared on the surface of YT15 cemented carbide and the effects of different plating parameters on the plating speed and the microstructure and properties of the coating were studied. The coating deposition rate was measured by the gravimetric method. The bond strength between the coating and the substrate was qualitatively analyzed by scratching method. The morphology and composition of the coating surface and cross section were compared by scanning electron microscopy (SEM). The results show that the optimum technological parameters are copper sulfate concentration of 1.25 g / L, pH = 11, plating temperature of 90 ℃, and deposition rate of 0.61 g / m 2 · min. The coating is uniform and compact with Ni and Cu as main components. The combination of close, and solder infiltration of a good, strong solderability.