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在真空电炉中利用机械合金化和热压烧结法制备出纳米晶块体钨铜合金。在进行电击穿实验时,电弧在其表面出现了分散现象,明显不同于相应传统材料电弧集中在局部的现象。这是由于纳米材料在电击穿时由于较低的逸出功、大量晶界的存在和纳米尺度的粒子能窄化钨铜界面的势垒而诱发大量电子发射所致。
Nanocrystalline bulk tungsten-copper alloy was prepared by mechanical alloying and hot-pressing sintering in a vacuum electric furnace. In the electric breakdown test, the electric arc appeared on the surface of the dispersion phenomenon, obviously different from the corresponding traditional material arc concentrated in the local phenomenon. This is due to a large amount of electron emission induced by the nano-materials due to the lower work function, the presence of a large number of grain boundaries and the nanoscale particles that can narrow the barrier at the tungsten-copper interface during electrical breakdown.