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环氧树脂潜伏性固化剂广州川井电子材料有限公司采用日本最新技术,生产一系列的环氧树脂潜伏性固化剂和促进剂,主要用于制造单组分胶粘剂、粉末涂料、电子油墨、复合材料等。主要产品一、有机脲类100A/100B双氰胺和酰肼的促进剂,能将双氰胺的固化温度降到90℃;但以120~140℃为最佳固化温度,主要用于单组分胶粘剂,复合材料等领域。二、潜伏性咪唑MC120D/HT110/1202/1203/8000K/8030/2MZ-A可以作为固化剂及双氰胺的促进剂,不同的型号表现不同的性质,有耐热型、光亮型、半光亮型、哑光型、根据用途选用。
Epoxy latent curing agent Guangzhou Kawai Electronic Materials Co., Ltd. using the latest technology in Japan, the production of a series of latent epoxy curing agents and accelerators, mainly used in the manufacture of single-component adhesives, powder coatings, electronic ink, composite materials Wait. The main products, organic urea 100A / 100B dicyandiamide and hydrazide accelerator, dicyandiamide curing temperature can be reduced to 90 ℃; but to 120 ~ 140 ℃ for the best curing temperature, mainly for a single group Divided adhesive, composite materials and other fields. Second, the latent imidazole MC120D / HT110 / 1202/1203 / 8000K / 8030 / 2MZ-A can be used as a curing agent and dicyandiamide accelerator, different types of performance of different properties, heat-resistant, bright, semi-bright Type, matte type, according to the use of choice.