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环压强度(ring crush,RC)测试和短程压缩强度(short-span compression,STFI)测试可被用于评价瓦楞纸板类产品的压缩强度,并且这些测试结果与多层纸板的强度有很好的相关性。由于每种测试方法是在不同长度范围内来评价纸张强度,这种相关性是有所差异的。研究发现,环压强度的测试结果与瓦楞纸板的边缘压溃测试(ECT)的相关性较好,甚至在仅用较少RC测试纸样来预测纸板的RC以及由多层纸板的层合点所造成的纸板性能的变化也考虑在内的情况下也是如此;将这种差别与每种测试方法不同的机理上的缺陷关联起来,这种缺陷与多层纸板的测试长度范围不同是有关系的。
The ring crush (RC) test and the short-span compression (STFI) test can be used to evaluate the compressive strength of corrugated board products and these test results are in good agreement with the strength of the multilayer board Correlation. The correlation is somewhat different because each test method evaluates paper strength over a range of lengths. The study found that the ring crush test results correlate well with the corrugated cardboard edge crush test (ECT), even with less RC test paper to predict the paperboard RC and the multi-layer board laminates Of the variation in board performance is also taken into consideration; this difference is related to the different mechanistic deficiencies of each test method, which are related to the different test lengths of the multi-layer board.