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引言金的化学惰性和良好的焊接特性使其在电子工业中得到广泛的应用,例如半导体器件的内外引线经常采用镀金层以保证良好的电接触性能和抗腐蚀性。镀金层的质量与器件可靠性密切相关。目前国产半导体器件的金层保护性能较差,由此而引起的管腿断裂,可焊性差等问题都尚未解决。因此对于高可靠性(high reliability)器件来说,它已成为影响其性能的主要因素之一。
Introduction The chemical inertness of gold and its good soldering properties make it widely used in the electronics industry. For example, the inner and outer leads of semiconductor devices are often plated with gold to ensure good electrical contact and corrosion resistance. The quality of the gold plating is closely related to the device reliability. At present, the domestic semiconductor device protection layer of the poor performance of gold, the resulting leg rupture, poor solderability and other issues have not yet been resolved. So for high reliability (high reliability) devices, it has become one of the main factors that affect its performance.