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电子技术的发展和功率密度的增加看来似乎是齐驱并进的。其动向是要在一个5瓦电子设备外壳中散发10瓦功率。这将要求新的,完善的热封装技术,以满足正在增大的热耗散要求。热管提供了一种有前途的技术,它既能达到高密度封装,又能保持合理的工作结温。休斯—富勒登就热管的发展进行了许多研究,其目的在于减少电子设备中从结到末级散热器的总的热阻。这些电子设备已用在警戒,预报,火力控制,舰艇和飞机导航。在所提出的技术论文中介绍了这些研究结果。
The development of electronic technology and the increase of power density seems to be moving forward simultaneously. The move is to emit 10 watts of power in a 5 watt electronics enclosure. This will require new and improved heat-encapsulation technologies to meet the increasing heat dissipation requirements. The heat pipe offers a promising technology that achieves high-density packaging while maintaining a reasonable operating junction temperature. Hughes-Fullerton has done a lot of research on heat pipe development to reduce the overall thermal resistance from the junction to the final stage of the electronics. These electronic devices have been used in alerting, forecasting, fire control, naval and aircraft navigation. These findings are presented in the proposed technical paper.