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采用热压烧结法制备出致密的短切SiCf增强LAS玻璃陶瓷复合材料,并讨论保温时间与热压压力对复合材料介电性能的影响。结果表明,测试频率在8~12GHz之间,复合材料复介电常数实部ε′由基体的7.6上升到10~100,虚部ε″由基体的0.34上升到40~160,介电损耗tgδ由基体的0.04上升到1~20,并具有明显的频散效应。随保温时间的延长或热压压力的提高,复合材料ε′增大,ε″与tgδ减小。此外,断口形貌的SEM观察表明,随保温时间的延长或热压压力的提高,复合材料界面层变厚。
The compact chopped SiCf reinforced LAS glass-ceramic composites were prepared by hot-pressing sintering. The effects of holding time and hot pressing pressure on the dielectric properties of the composites were discussed. The results show that the real part ε ’of complex permittivity increases from 7.6 to 10-100 in the matrix and the imaginary part ε “increases from 0.34 to 40 ~ 160 in the matrix, and the dielectric loss tgδ From 0.04 to 1 ~ 20, the matrix has obvious dispersion effect.With the increase of holding time and hot pressing pressure, the composite ε ’increases and ε ”and tgδ decreases. In addition, SEM observations of the fracture morphology show that the interface layer of the composite material becomes thick with the increase of holding time or the increase of hot pressing pressure.