本文通过对封装辅料及涂覆工艺的研究,分析了LED荧光粉粒径、模条卡点及涂覆方式对白光LED光学性能的影响。实验采用小功率直插式LED封装工艺,结果表明,选择小粒径的荧光粉可以显著提高产品的光色均匀性;使用高卡点的模条及高涂覆方式,可以提升发光效率5%以上;而采用相反方式涂覆工艺,垂直光强可相对增加30%以上。 In this paper, the encapsulation materials and coating technology research, analysis of the LED phosphor particle size, the mold of the card point and the coating on the white LED optical properties. Experiments using low-power in-line LED packaging process, the results show that the choice of small particle size phosphors can significantly improve the product color uniformity; use of high-caliber mold and high-coating mode, you can enhance the luminous efficiency of 5% Or more; while using the opposite way of coating process, the vertical light intensity can be relatively increased by more than 30%.