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Remtech公司最近完成了罗姆实验一个项目的第一阶段工作。该项目名为“用闭合式程序(closed form procedures)对电子器件进行自动热评价和振动评价”。其目的是对印刷电路板进行结构和热筛选。有限元分析用于评价引线和焊缝的结构反应和热反应有很大的作用,也很精确,但用作筛选手段其速度太慢,并且太不方便。这个项目第一阶段的目标,就是要验证使用闭合式程序能否获得足够的数字精确度。Remtech公司研制了一种交互式Macintosh计算机代码,使用者可迅速确定四种不同的电路板结构对特定热冲击或振动环境作出的反应。
Remtech recently completed the first phase of a project on the Roma experiment. The project is entitled “Automatic Thermal Evaluation and Vibration Evaluation of Electronic Devices with Closed Form Procedures.” Its purpose is to fabricate and heat screen printed circuit boards. Finite element analysis is used to evaluate the structural and thermal reactions of leads and welds. It is also very accurate and accurate, but it is too slow and inconvenient to use as a screening tool. The goal of the first phase of this project is to verify that sufficient numerical accuracy can be achieved using a closed procedure. Remtech has developed an interactive Macintosh computer code that allows users to quickly determine how four different circuit board configurations react to specific thermal shocks or vibrations.