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传递模塑制造技术被成功应用到600伏范围的集成功率模块(IPM)已经有五年之久。对内部模块结构的进一步改进,例如引线架和散热片的优化以及由于IGBT芯片制造技术的重大改善使载流子存储栅双极晶体管(CSTBT)实用化,这些改进为低成本,高可靠性和热稳定性好的功率模块生产提供可能。最近600伏DIP IPMs的功率已经能达到3.7KW。本文将传递模塑技术进一步扩展,将其用于额定电流从10A到25A的1200V CIB模块,该模块通过1200伏HVIC来驱动和保护。这篇文章将详细介绍DIP CIB模块的特征和专用1200伏HVIC的功能。对于一个功率为3.7KW的完整逆变器包括三输入整流器,闸流断路器和三输入逆变器以及对基板温度敏感的NTC,所有这些部件通过传递模塑技术被精密封装,可达到UL和IEC所要求的最小爬电和电气间隙。
Transfer molding has been successfully applied to integrated power modules (IPMs) in the 600-volt range for five years. Further improvements to the internal module structure, such as the optimization of leadframes and heat sinks, and the practical improvement of CSTBTs due to the significant improvements in IGBT chip fabrication techniques have led to the development of low cost, high reliability and Thermostable power module production possible. The power of the 600-volt DIP IPMs has reached 3.7KW recently. In this paper, the transfer molding technology is further extended to use with 1200V CIB modules rated at 10A to 25A and driven and protected by 1200V HVICs. This article will detail the features of the DIP CIB module and the features of a dedicated 1200 volt HVIC. A complete 3.7KW inverter includes a three-input rectifier, a thyristor breaker and a three-input inverter, and a temperature-sensitive NTC to the substrate. All of these components are precision encapsulated by transfer molding to achieve UL and IEC minimum required creepage and clearance.