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研究了IC塑封浇注系统对金线偏移的影响,通过数值模拟对金线偏移现象进行理论分析与预测,以金线偏移量最小为标准,对浇口参数进行优化。在模拟优化的基础上设计制造了不同浇口参数的模具镶件,对模拟结果进行实际验证。实验中采用X射线检测技术,提出了一种新的对金线偏移程度观测的方法。结果表明:型腔压力随浇口厚度H的增加而变小,入射角α的变化对压力的影响相对较小;厚度为0.25 mm,入射角为50°的浇口尺寸为最优;浇口厚度为0.25 mm,入射角为50°时的金线实际偏移量平均值为0.049 mm,金线偏移程度最小;浇口厚度为0.25 mm,入射角为30°时,金线实际偏移平均值为0.072 mm,金线偏移程度最大。
The influence of IC plastic casting system on the gold line offset was studied. The gold line offset phenomenon was theoretically analyzed and predicted by numerical simulation. The gate parameters were optimized with the minimum gold line offset as the standard. Based on the simulation and optimization, mold inserts with different gate parameters were designed and manufactured, and the simulation results were verified. In the experiment, X-ray detection technology was used to propose a new method to observe the degree of gold line offset. The results show that the cavity pressure decreases with the increase of the gate thickness H, and the change of the incident angle α has a relatively small influence on the pressure. The gate size with the thickness of 0.25 mm and the incident angle of 50 ° is the best. When the thickness is 0.25 mm and the incident angle is 50 °, the average value of the actual gold wire displacement is 0.049 mm and the gold wire offset degree is the minimum. When the gate thickness is 0.25 mm and the incident angle is 30 °, the actual gold wire shift The average value is 0.072 mm, the maximum gold line offset.