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技术开发单位中国电子科技集团公司第五十八研究所技术简介MEMS气体传感器是利用半导体气敏元件与气体接触会造成半导体的电导率等物理性质发生变化的原理来检测特定气体的成分或浓度的传感器。该技术以低吸释气芯片焊接成套技术为关键工艺,是一种高可靠陶瓷封装技术,从材料本质上提高了半导体气敏传感器的耐腐蚀沾污能力,提升了产品的稳定性与可靠性,延长了其使用寿命,并可实现批
Technology Development Unit China Electronics Technology Group Corporation fifty-eighth Institute of Technology Introduction MEMS gas sensor is the use of semiconductor gas sensors and gas contact will cause the semiconductor conductivity and other physical properties of the principle of change to detect a specific gas composition or concentration sensor. The technology of low-pressure gas chip welding package technology as the key process is a highly reliable ceramic packaging technology, from the material essentially enhance the resistance of semiconductor gas sensor stain resistance and enhance the stability and reliability of the product , Extend its useful life, and can achieve batch