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为了适应目前电路组装高密度要求,微电子封装技术的发展正日新月异,各种新技术、新工艺层出不穷。最新出现的CSP(芯片尺寸封装)更是使裸芯片尺寸与封装尺寸基本相近,这样在相同封装尺寸时可有更多的I/O数,使电路组装密度大幅度提高。但是人们在应用中也发现,无论采用何种封装技术后的裸芯片,在封装后裸芯片的性能总是比未封装的要差一些。于是人们对传统的混合集成电路(HIC)进行彻底的改变,提出了多芯片组件(Multi Chip
In order to meet the current high density circuit assembly requirements, the development of microelectronic packaging technology is changing with each passing day, a variety of new technologies, new processes after another. The latest CSP (chip size package) is the bare chip size and package size are similar, so that the same package size can have more I / O number, the circuit assembly density increased significantly. However, people also found in applications that the die performance of a bare chip after encapsulation is always worse than that of a non-encapsulated chip. As a result, people completely changed the traditional hybrid integrated circuit (HIC), and proposed a multi-chip module (Multi Chip