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本发明系钎焊合金,特别是有关银溶解度低的低温钎焊合金。随着电子零件的小型化,陶瓷电容器的容量也变小,其所用的陶瓷、氧化铝基板非常薄。因此,该基板对热冲击承受力减弱,如在高温下钎焊,恐会引起裂纹、破裂等损伤。另外,有时在陶瓷电容器上还要钎焊上焊料,此时,第二次钎焊温度如比第一次的钎焊合金固相线温度高,则在钎焊部位将会发生熔化或剥离等情况。所以二次钎焊所用的合金必须用熔化温度低的低温软钎料。因此,对薄的陶瓷容器,陶瓷电容器的二次钎焊就要求银的溶解度低,而且熔点要低。
The present invention is a brazing alloy, in particular, a low-temperature brazing alloy with low silver solubility. With the miniaturization of electronic components, the capacity of ceramic capacitors also becomes smaller, and the ceramic and alumina substrates used therein are very thin. Therefore, the thermal shock resistance of the substrate to withstand weakening, such as brazing at high temperatures, fear may cause cracks, rupture and other damage. In some cases, solder may be soldered on the ceramic capacitor. In this case, if the second soldering temperature is higher than the solidus temperature of the first soldering alloy, melting or peeling may occur in the soldering portion Happening. Therefore, the secondary brazing alloy used must be low melting temperature of low temperature solder. Therefore, for thin ceramic containers, secondary soldering of ceramic capacitors requires low solubility of silver and low melting point.