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众所周知,在实际使用中,IGBT(绝缘栅双极晶体管)模块的结温是不能被直接测量的。但是,可以采用一个替代方法,即采用实时热模型来估计结温。估计结温的工作是非常有用的,例如,能通过估计的结温改进热的保护工作。但是,要达到实用的目标,采用的热模型必须足够精确。因为这是实时操作规范,因此考虑计算的高效率也是一项非常重要的指标。本文提出了一个热阻矩阵模型方法,该方法既具有结果精确,也具有计算效率高的优点。提出的方法是采用了一个新颖的多速率(multirate)方法,这个方法和传统方法相比,能节省大量的计算工作。通过和一个采用s面(s-plane)Simulink模型的结果相对比,可以得出结论:通过本方法计算结果的精确性是较好的。通过对DSP(数据信号处理器)的具体试验实例进行工作。工作结果证实:本文提出的方法的计算效率是高的。本文得到的结果使只需采用有限的计算工作,就能将实时热模型方便地应用到各种功率电子领域。
As we all know, in actual use, IGBT (Insulated Gate Bipolar Transistor) module junction temperature can not be measured directly. However, an alternative approach is to use a real-time thermal model to estimate the junction temperature. The work of estimating junction temperature is very useful, for example, thermal protection can be improved by the estimated junction temperature. However, to achieve a practical goal, the thermal model used must be accurate enough. Because this is a real-time operating specification, it is also a very important indicator to consider the high efficiency of the calculation. In this paper, a thermal resistance matrix model is proposed, which has the advantages of accurate results and high computational efficiency. The proposed method uses a novel multirate method that can save a lot of computational effort compared to traditional methods. By comparing with the result of a s-plane Simulink model, we can conclude that the accuracy of the results calculated by this method is better. Through the DSP (data signal processor) to test the specific examples. The results of work confirm that the computational efficiency of the proposed method is high. The results obtained in this paper make it possible to easily apply the real-time thermal model to all kinds of power electronics with only limited computational effort.