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在电子工业中,陶瓷器件的应用正在日益增加,例如:混合电路、多层陶瓷电路,接头,管痤、绝缘子和电容器等。在制作这些产品的过程中通常要求局部镀,有时要求直接镀于陶瓷表面或陶瓷的金属化表面。目前对陶瓷表面和金属化表面的涂敷尚缺乏全面的了解。本文讨论了几种成熟的工艺。对于烧结在陶瓷上的 Mo-Mn、W、Mo、Cu 金属化层采用化学镀 Ni-B 或 Ni-P,能满足电子工业的各种要求。
In the electronics industry, the application of ceramic devices is increasing, for example: hybrid circuits, multilayer ceramic circuits, connectors, tubes, insulators and capacitors. Partial plating is usually required in the manufacture of these products, sometimes requiring direct plating on the ceramic surface or the metallized surface of the ceramic. There is currently no comprehensive understanding of the application of ceramic and metalized surfaces. This article discusses several mature processes. For the Mo-Mn, W, Mo, Cu metallized layers sintered on ceramic, electroless Ni-B or Ni-P electroless plating can meet various requirements of the electronics industry.