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采用LS-Dyna软件分析了双层平板模拟机匣的抗冲击性能,讨论了层间距和厚度分配对双层平板模拟机匣抗冲击性能的影响。研究结果表明:在叶片正撞击时,双层模拟机匣的损伤为局部剪切和整体塑性变形的混合型。层间距只影响外层板吸收的能量,随着层间距的变化,双层平板吸收能量没有一定规律。厚度分配比小于1时,双层板的抗冲击性能随着厚度分配比的减小而增强;厚度分配比大于1时,双层板的抗冲击性能随着厚度分配比的增大而增强。
The impact resistance of double-layer flat simulator casing was analyzed by LS-Dyna software. The influence of interlayer spacing and thickness distribution on the impact resistance of double-layer flat casing was discussed. The results show that the damage of two-layer simulator casing is a mixture of local shear and plastic deformation when the blade is impacting directly. Layer spacing only affects the energy absorbed by the outer plate, with the layer spacing changes, there is no certain law of the double plate absorption energy. When the thickness distribution ratio is less than 1, the impact resistance of the double-layer board is enhanced with the decrease of the thickness distribution ratio. When the thickness distribution ratio is more than 1, the impact resistance of the double-layer board increases with the increase of the thickness distribution ratio.