硅,这种在电子学领域应用最为广泛的材料,正在以多种新的途径进行着制造和应用。过去,将大的硅晶体切成越来越薄的衬底,并在加工过程中弃去受损伤的材料。而现在,因为改进了化学汽相淀积技术,可以将硅直接以薄膜的形式沉积出来,不用再进行切片成形工序。因此,硅只用在需要它的部位,消除了废料。 Silicon, the most widely used material in electronics, is being manufactured and applied in many new ways. In the past, large silicon crystals were cut into thinner and thinner substrates, and the damaged material was discarded during processing. And now, because of the improved chemical vapor deposition technology, silicon can be directly deposited in the form of thin film, no longer need to slice forming process. Therefore, silicon is used only where it is needed, eliminating scrap.