在芯片封装领域正掀起一波技术改革潮,可望大幅降低封装成本与芯片价格,并催生更廉价的终端电子产品;但这波改革与炒得正热的3D芯片——即所谓的硅穿孔(through-silicon-vias,TSV)芯片堆栈技术——关联性不大,而是原本以黄金(gold)为主要材料的打线接合(wirebonding)技术,突然 In the field of chip packaging is set off a wave of technological innovation wave, is expected to significantly reduce packaging costs and chip prices, and the birth of cheaper terminal electronics; but this wave of reform and speculation is hot 3D chip - the so-called silicon perforation (through-silicon-vias, TSV) chip stacking technology - not much, but the original gold wire as the main material of the wire bonding (wirebonding) technology, suddenly