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溅射腐蚀又可称为逆溅射、反溅射,离子腐蚀、溅射清洗等,这一工艺可广泛地用于半导体、绝缘体和导体材料,特别适用于多层布线的集成电路工艺、浅结工艺非常有用。溅射腐蚀的优点为。1.一般的化学腐蚀,在腐蚀窗总要产生钻蚀或侧向腐蚀,而溅射腐蚀穿过抗蚀剂窗孔可作垂直壁腐蚀。2.在浅结工艺中,可以达到只腐蚀几埃的深度要求,做到可控,这在化学腐蚀中,或者是办不到,亦或达不到可控要求。3.不需用化学腐蚀剂就达到腐蚀目的。4.可以作小孔的深腐蚀。5.这种技术还可用于作表
Sputter etching can also be called reverse sputtering, reverse sputtering, ion etching, sputtering cleaning, etc. This process can be widely used in semiconductor, insulator and conductor materials, especially suitable for multi-layer wiring integrated circuit technology, shallow Knotting process is very useful. The advantages of sputter etching are. 1. General chemical etching, always in the corrosion of the window to produce drilling or lateral corrosion, and sputter etching through the resist hole for vertical wall corrosion. 2 in the shallow knot technology, you can reach only the depth of corrosion of a few Egyptian requirements to be controlled, which in chemical corrosion, or can not do, or reach the control requirements. 3. Do not need to use chemical etchants to achieve the purpose of corrosion. 4. Can make small holes deep corrosion. 5. This technique can also be used to make tables