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介绍用微波谐振腔测量片状介质材料的电导率、介电常数和半导体非平衡载流子寿命的方法．对圆柱腔ＴＥ０１１模端盖上的哑铃状孔－缝的特性进行了研究，指出单个哑铃状孔－缝与ＴＥ０１１模耦合很弱，两个对称的哑铃状孔－缝与ＴＥ０１１模具有较强的耦合，后者可用于小损耗片状介质材料介电常数、半导体材料非平衡载流子寿命等参数的测量．因为测量是无接触的，所以无需对样品进行特殊加工．ＴＥ０１１模品质因数Ｑ值高，因而测量具有较高的精度．
The method of measuring the electrical conductivity, dielectric constant and the non-equilibrium carrier lifetime of a sheet dielectric material with a microwave resonator is introduced. The characteristics of the dumbbell-shaped hole-slit on the TE011 die end cap were studied. It was pointed out that the single dumbbell-shaped hole-slit was weakly coupled with the TE011 die. Two symmetrical dumbbell-shaped holes - Which can be used to measure the dielectric constant of small lossy sheet dielectric material and the parameters of the semiconductor material such as unbalanced carrier lifetime. Because the measurement is contactless, no special processing of the sample is required. TE011 mold quality factor Q value is high, so the measurement has high accuracy.