美国 Zuken公司提出在年内使用新开发的 3 D封装合成器 ,即具有先进 IC封装方法的新器件 ,来开发其股东 Amkor技术公司。这种合成器的设计可制作多层薄膜并可检测 3 D集成电路封装中多层膜的连线结构 ,而不需要理论模型或复合 3 D的机械 CAD图形就可确认。多层薄膜封装是一种裸 US company Zuken proposes to develop its shareholder Amkor Technologies using the newly developed 3-D package synthesizer, a new device with advanced IC packaging methods, during the year. This synthesizer is designed to produce multilayer films and to detect the wiring structure of multilayer films in 3-D integrated circuit packages without the need for theoretical models or mechanical 3-D CAD drawings. Multi-layer film packaging is a nude