目前集成电路光刻方式主要利用接触法。如人们所知那样,接触法是掩模和片子紧紧挨着,瞄准光从上边曝光,这种光刻机造价低,而且可以得到分辨率高、反差好的像。与此相反,定位时两者必须接触,因片子的凸起和毛刺及灰尘等原因,掩模和片子子双方都会在不同程度上被划伤,这是最大的缺点。 The current integrated circuit lithography method using the main contact. As we all know, the contact method is the mask and the film closely next to the aiming light exposure from above, this lithography machine is low cost, and can get high resolution, good contrast. On the other hand, the two must be in contact with each other, and the mask and the chip are scratched in varying degrees due to the bumps and glitches of the film and the like, which is the biggest disadvantage.