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1 概述1.1基本概念 脉冲电镀广泛定义为间断电流电镀。间断电流是指正向电流在某一时间出现而在另一时间出现反向电流。自50年代开始,就已有人从事脉冲电镀的研究,因脉冲电流能使镀层结晶细化、结合力高、无孔隙,使镀层有优良的物理化学性能。 印制电路板(PCB)行业使用的脉冲电镀,严格的说应称为周期脉冲反向电流(PeriodicPulse Reverse Plating)。周期脉冲反向电镀(PPR)的工作原理是应用正向电流电镀一段时
1 Overview 1.1 Basic Concepts Pulse plating is widely defined as intermittent current plating. Intermittent current refers to the forward current appears at a time while the reverse current occurs at another time. Since the 1950s, some people have been engaged in the research of pulse plating, because the pulse current can make the coating crystal refinement, high binding force, no porosity, the coating has excellent physicochemical properties. Pulse plating used in the printed circuit board (PCB) industry, strictly speaking, should be referred to as Periodic Pulse Reverse Plating. Periodic Pulse Reverse Plating (PPR) works by applying forward current for a period of time