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研究了熔渗法制备的Mo-Cu复合材料从350～20 K的导热率变化。结果表明,该材料在350 K的导热率为200 W/(m.K)。随着温度降低,导热率降低,降温至200 K后导热率升高,20 K时导热率达305 W/(m.K)。将样品用浓硝酸腐蚀去除铜组分后观察微观组织发现,Mo在熔渗制备过程中已烧结成骨架结构,这种结构的形成是低温材料导热率升高的原因。
The thermal conductivity of Mo-Cu composites prepared by infiltration method was studied from 350 to 20 K. The results show that the thermal conductivity of the material at 350 K is 200 W / (m.K). As the temperature decreases, the thermal conductivity decreases, and the thermal conductivity increases after cooling to 200 K, with a thermal conductivity of 305 W / (m.K) at 20 K. After the sample was treated with concentrated nitric acid to remove copper, the microstructure was observed. The results showed that Mo had been sintered into the skeleton structure during infiltration process. The formation of this structure was the reason of the increase of thermal conductivity of low temperature materials.