调查机构YOLE表示,目前碳化硅和氮化镓材料正在与传统硅材料激烈竞争,占据从低功率到高功率应用的巨大市场。目前,宽禁带器件市场并不像预期的那样发展迅猛。器件应用的四大阻碍分别是:器件层面的高成本,可靠性,多方供应商和集成能力。近年来针对新型材料的研发项目不断出炉,有一些提案显示从系统层面判断,应用宽禁带器件时的材料清单成本(BOM)可有效降低。 Research firm YOLE said that silicon carbide and gallium nitride materials are currently fierce competition with traditional silicon materials, occupy a huge market from low-power to high-power applications. At present, the wide band-gap device market is not growing as fast as expected. The four major impediments to device application are: high cost at the device level, reliability, multi-vendor and integration capabilities. In recent years, research and development projects for new materials have been unveiled. Some proposals have shown that judging from the system level, the bill of materials (BOM) when using wide bandgap devices can be effectively reduced.