日本Ｓｕｍｉｔｏｍｏ电子工业有限公司开发出一种新型制金属粉技术 ,任何可以用来电镀的金属都可用这种方法制粉。其方法是 :在含有待制粉金属离子、钛离子和一种特殊化学物质的溶液中通入电流 ,在阴极可生成金属微粉 ,获得金属颗粒的大小可由通电时间和电流强度控制 ,据称使 Japan Sumitomo Electronics Industrial Co., Ltd. has developed a new metal powder technology, any metal can be used for plating can be used this method milling. The method comprises the following steps: passing a current into a solution containing metal ions to be pulverized, titanium ions and a special chemical substance to produce metal micropowder at the cathode, the size of the obtained metal particles can be controlled by the energization time and the current intensity,