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用三维元胞自动机法(CA法)模拟纯铜在400℃以0.0005s-1的应变率发生动态再结晶(DRX)的过程。给出了母相和再结晶晶粒的平均位错密度随着应变量的变化规律;根据平均位错密度的变化研究了纯铜动态再结晶中形核、长大、动态回复和加工硬化等过程。模拟了纯铜动态再结晶过程中的应力-应变曲线及平均晶粒尺寸的变化规律,模拟结果与文献中的试验结果吻合较好。
The dynamic recrystallization (DRX) process of pure copper at 0.0005s-1 strain rate was simulated by the three-dimensional cellular automata method (CA method). The average dislocation density of the parent phase and recrystallized grains is given as a function of the amount of strain. According to the variation of average dislocation density, the nucleation, growth, dynamic recovery and work hardening in the pure copper dynamic recrystallization process. The stress-strain curve and the variation law of the average grain size in the dynamic recrystallization of pure copper were simulated. The simulation results are in good agreement with the experimental results in the literature.