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本文用X射线光电子能谱、Fourier变换红外光谱以及计算机光谱分峰,定量地研究了P(MMA-MAA)/PEO氢键复合物的氢键以及组成、温度、张应变对氢键的影响。实验结果表明,该复合物的形成,使MAA自由羧基由38.9%下降到13.8%,自缔合形成氢键的羧基由61.1%下降到45.4%,而大量的与醚氧形成的氢键使氢键的总比例由61.1%上升到86.2%。随共聚物中MAA含量的增加,复合物中自缔合羧酸以及与PEO的醚氧形成氢键的羧基增多,后者在酸含量为0.775mol分数时达到极大值。在高温或张应力作用下,复合物的氢键弱化,分子易产生相对位移,而在循环应力作用下表现为塑性变形增加,弹性回复减小,反映了氢键复合物中氢键对温度、应力的敏感的物理交联特性。
In this paper, X-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy and computer spectroscopy were used to quantitatively study the hydrogen bonding and the effect of composition, temperature and tensile strain on hydrogen bonding of P (MMA-MAA) / PEO hydrogen bonding complexes. The experimental results showed that the formation of the complex reduced the free carboxyl content of MAA from 38.9% to 13.8%, decreased from 61.1% to 45.4% of the carboxyl groups self-associating with hydrogen bonds, while a large number of hydrogen bonds with ether oxygen formed hydrogen The total key ratio increased from 61.1% to 86.2%. With the increase of MAA content in the copolymer, the number of self-associating carboxylic acids in the complex and the number of carboxyl groups forming hydrogen bonds with the ether oxygen of PEO increased, and the latter reached a maximum when the acid content was 0.775 mol. Under the action of high temperature or tensile stress, the hydrogen bond of the complex is weakened, and the molecule tends to produce relative displacement. Under cyclic stress, the plastic deformation increases and the elastic recovery decreases, which reflects the effect of hydrogen bond on the temperature, Sensitive physical cross-linking properties of stress.