论文部分内容阅读
随着电路层的垂直堆叠,三维集成电路(3D-IC)的功耗密度成倍增加。具有良好散热能力的层间液体冷却是一种非常有效的方法。采用数值模拟的方法研究了雷诺数在150~900范围内面积为1cm~2,针肋直径为100μm,通道高为200μm,通道间距为200μm的带有层间顺排微针肋两层芯片堆叠3D-IC内流体流动与换热特性。结果表明:与相应尺寸的矩形通道结构相比,带有层间顺排微针肋液体冷却3D-IC具有良好的换热效果。在雷诺数为770时,芯片的功率高达250W,其体积热源相当于8.3kW/cm~3;较矩形结构通道,顺排微针肋结构的热源平均温度和热源最大温差只有46.34,13.96K,分别减小了13.26,21.34K。
With the vertical stacking of circuit layers, the power density of three-dimensional integrated circuits (3D-ICs) has multiplied. Interlayer liquid cooling with good heat dissipation is a very effective method. A two-layer microchip stack with inter-layer microtiter microtips with a Reynolds number of 1cm ~ 2 in the range of 150 ~ 900, a needle-hole diameter of 100μm, a channel height of 200μm and a channel spacing of 200μm was studied by means of numerical simulation. Fluid Flow and Heat Transfer Characteristics in 3D-IC. The results show that liquid-cooled 3D-IC with interlaminar microneedle-ribbed liquid has good heat transfer performance compared with the corresponding rectangular channel structure. When the Reynolds number is 770, the power of the chip is as high as 250W, and the volume heat source is equivalent to 8.3kW / cm ~ 3. Compared with the rectangular structure channel and the inline microneedle rib structure, the average temperature of the heat source and the maximum temperature difference of the heat source are only 46.34 and 13.96K, Respectively, reduced 13.26,21.34K.