以非贵金属丝代替半导体器件及大规模集成电路球焊金丝,不仅具订十分巨大的经济效益,而且能提高内引线的焊接性能和高温强度,增大器件的可靠性和使用寿命,实现高密度、长回路的配线。本文指出只要在焊接时增加气体保护,适当改变焊接工艺,就可以得到与高纯 Au丝相匹敌的效果。 Non-precious metal wire instead of semiconductor devices and large-scale integrated circuit ball welding gold, not only with a very large economic benefits, and can improve the inner lead welding performance and high temperature strength, increase device reliability and service life, to achieve high Density, long circuit wiring. This paper points out that as long as the increase in gas welding protection, appropriate changes in welding process, you can get the same effect with high purity Au wire.