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三、最近进展CVD 技术近年来的发展趋势是:(1)降低处理温度,即所谓低温 CVD 法。众所周知,普通 CVD(或称 HT-CVD)有如下缺点:如在高温下基体和沉积层中的合金元素相互扩散而于交界处形成脆性的相,使工件不能承受冲击载荷;同时工件易于变形而不利于精密工具的处理;此外,不宜用于某些奥氏体化温度低的合金钢,因为普通 CVD 会使晶粒长大而降低
Third, the recent progress CVD technology in recent years, the development trend is: (1) reduce the processing temperature, the so-called low-temperature CVD method. It is well-known that common CVD (or HT-CVD) has the following disadvantages. For example, the alloy elements in the matrix and the deposited layer diffuse to each other at high temperatures to form a brittle phase at the interface so that the workpiece can not withstand the impact load; at the same time, the workpiece is easily deformed Is not conducive to the processing of precision tools; In addition, it should not be used for some austenitizing low alloy steel, because ordinary CVD will make the crystal grow and reduce