来自 NIST研究人员新的理论分析 ,提供了一种测试材料内应力的技术 ,该内应力将引起材料裂纹。金属材料和半导体材料的制造者及相关人员都可以用该技术来检测微电子封装 ,钢板焊缝或其它材料内部的缺陷。该技术由计算机分析声波 ,这些波被发射到材料内部 ,并通过在声学显微镜里 A new theoretical analysis from NIST researchers provides a technique for testing the internal stress of a material that will cause the material to crack. Manufacturers of metal materials and semiconductor materials and related personnel can use the technology to detect defects within microelectronic packages, sheet metal welds or other materials. The technique analyzes sound waves by a computer and these waves are launched into the material and passed through an acoustic microscope