【摘 要】
：
The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Boar
【机 构】
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School of Microelectronics and Information Engineering University of Electronic Science and Technol
【出 处】
：
Journal of Electronic Science and Technology of China
论文部分内容阅读
The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board (PCB) is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.
The main characteristics, applications, the emphases of manufacturing processes are presented, and the research of new product of rigid-flex Printed Circuit Board (PCB) is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches 89.4%.
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