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热设计是大功率移相器设计中必须考虑的环节,使用有限元仿真技术对对某型号移相器产品的热特性进行了模拟研究,建立了移相器热仿真模型。模拟所得最高结温与实验结果能较好吻合,验证了所用模型及方法的正确性。研究分析了不同芯片和基板粘结焊料空洞率、基板厚度以及不同基板材料和相对温升的关系,这些参数和温升定量关系,可以为移相器产品的热设计、优化参数、提高其可靠性提供理论依据。
Thermal design is a must in high-power phase shifter design. The finite element simulation technology is used to simulate the thermal characteristics of a phase shifter. The thermal phase shifter simulation model is established. The simulation results of the maximum junction temperature and the experimental results can be better consistent, verify the correctness of the model and method used. The relationship between void ratio, substrate thickness, and substrate temperature and relative temperature rise of different chips and substrates is analyzed. The quantitative relationship between these parameters and temperature rise can be used to optimize the thermal parameters of phase shifter products and optimize their reliability Sex provides a theoretical basis.