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IBM、索尼、SCEI、东芝四家世界著名半导体公司已商定在今后几年内共同开发新一代以及再新一代世界先进半导体技术,以此拉动应用于从数字家电到超级PC领域的超高性能、低消耗系统级芯片的研究和开发。为了实施这一共同开发,仅在今后几年内就需要投入数亿美元,用于对300mm园片、O.05μm极微细加工技术的研发,其结果有可能把极多数量的半导体器件都集成在同一芯片内。基于上述新一代半导体技术,也将加快把分散地独立存
IBM, Sony, SCEI, Toshiba and four world-renowned semiconductor companies have agreed to jointly develop next-generation and next-generation world advanced semiconductor technologies in the next few years to drive ultra-high performance and low-end applications from digital home appliances to super PCs. Consumption of system-level chips for research and development. In order to implement this joint development, only hundreds of millions of dollars will be invested in the next few years for the research and development of 300mm wafers and O.05μm microfabrication technology. As a result, it is possible to integrate an extremely large number of semiconductor devices. Within the same chip. Based on the above-mentioned new generation of semiconductor technology, it will also speed up the independent decentralization of