Photoelectrochemically splitting water to hydrogen(H2)and oxygen(O2)driven by solar has been attracted more attention be......

In cutting of brittle materials,experimentally it was observed that there is an upper bond of tool cutting edge radius,b......

通过实验对比的方法对单晶硅太阳电池电致发光(EL)缺陷及不同工艺的影响进行了分析，测试了电池片的开路电压、短路电流、填充因子、......

Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers.Grinding......

The adherence and subsequent viability of central neural cells (substantia nigra)on silicon wafer with different surfac......

本文拟就当前国内外硅材料的市场情况及技术巽作一简介、以期使人事与关心硅材料工业的各界不为当前暂时困难受阻，而是看到我们的进......

为了将离心铸造技术成功地移植到低成本超薄多晶太阳电池硅片的成形工艺上，提出了ＥＬＣＣ技术的硅片液态成形方法，即将铸模型腔预热至硅熔点......