金在电子工业方面的需要,在最初仅仅局限于接点和接线柱上。可是近十年来,它在半导体领域内的使用却日益聚增。最初也仅用于晶体管管座,而最近,则把金用于扁平封装集成电路等的硅片热共晶粘接、内引线的熔接以及外引线的焊接。在对外引线进行了电镀后的焊接工作中,会招致金的损失,为了避免这种损失,在最近的生产工艺中采取了电镀以外的方法进行处理(对外引线使用金)。和以前相比,所进行的引线框架的部分镀金方法主要有二种。第一种是光致抗蚀 The need for gold in the electronics industry was initially confined to contacts and posts. However, in the past ten years, its use in the field of semiconductors has been increasing. Originally, it was also used only for transistor headers, and more recently, gold was used for thermal eutectic bonding of silicon wafers, soldering of inner leads, and outer leads of gold for flat packaging integrated circuits. In the welding of the lead wire after the electroplating, loss of gold is incurred. In order to avoid such a loss, plating other than the plating method has been adopted in the recent production process (using gold for the lead wire). Compared with the previous, there are mainly two kinds of gold plating methods for the lead frame. The first is photoresist