利用二维基板表面的混合IC获得了发展。但是,近年来,随着电子线路的小型化、轻量化、薄型化和多功能化,已广泛引入三维高密度安装技术。特别是在半导体IC的高性能、高功能化中,必须研究包括外围电路的综合高密度安装形式。为提高单位体积的电路密度,可通过电路布线的多层化来实现,其方法有如表1所示:(1)厚膜印刷法;(2)生薄板法;(3)薄膜法等等,应根据安装的电 Development has been made using hybrid ICs on two-dimensional substrate surfaces. However, in recent years, with the miniaturization, weight reduction, thinning, and multi-functionalization of electronic circuits, three-dimensional high-density mounting technology has been widely introduced. Particularly in the high performance and high functionalization of semiconductor ICs, it is necessary to study a comprehensive high-density mounting form including a peripheral circuit. In order to increase the density of the circuit per unit volume, it can be realized by multilayering the circuit wiring as shown in Table 1: (1) thick film printing method, (2) green sheet method, (3) thin film method and the like, Should be based on the installed electricity