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GEM膜理想的直径为70μm与间距为140μm。通过合作渠道获得了一些美国生产的GEM原膜的样品,可同CERN的原膜样品做比较。很多PCB技术在GEM膜的制造过程中被应用。现在已完成的工作为:1)掩膜板制作。将GEM膜的图案打印到掩模板上。2)干膜光刻胶的层压。使用热辊层压机将干膜光刻胶压到GEM原膜上。3)干膜光刻胶的曝光。曝光系统包括一个曝光单元、真空接触框架,光源冷却和曝光控制装置。通过曝光,会将掩模板图案精确地拷贝到干膜光刻胶上。
The ideal thickness of the GEM film is 70 μm and the pitch is 140 μm. Some samples of the original GEM film from the United States were obtained through a cooperative channel and compared with the original CERN film samples. Many PCB technologies are used in the manufacture of GEM films. Now completed work as follows: 1) mask production. The pattern of the GEM film is printed on the reticle. 2) Lamination of dry film photoresist. The dry film resist was pressed onto the original GEM film using a hot roll laminator. 3) dry film photoresist exposure. The exposure system includes an exposure unit, vacuum contact frame, light source cooling and exposure control. By exposure, the mask pattern is accurately copied to the dry film photoresist.