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日本铝公司开发并出售一种用超声波软钎焊方法焊接散热片和基板的供大型半导体元件冷却用的散热器。 该散热器与过去用真空硬钎焊方法生产的产品相比,不仅成本低,而且可使用的材质范围很广。价格约为1500～3000日元/kg左右。
Nippon Steel Corporation develops and sells a heat sink for cooling large-sized semiconductor components by soldering heat sinks and substrates by ultrasonic soldering. This radiator is not only less expensive than the products produced in the past by vacuum brazing, but also has a wide range of materials that can be used. The price is about 1500 ~ 3000 yen / kg or so.