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研究了C194铜合金引线框架表面氧化状态对封装树脂结合强度的影响。铜合金引线框架与树脂的结合强度随氧化膜厚度的增加而先增加后减小,并在厚度为100nm时达到最大值15.3MPa,比氧化前提高了2.6MPa。其原因在于氧化膜能够提高与封装树脂之间的润湿性,而氧化膜较厚时,断裂更易发生在疏松的氧化膜中,从而降低了结合强度。防铜变色剂处理可以通过有效减缓氧化膜生长来控制其结合强度。
The influence of the oxidation state on the surface of the C194 copper alloy lead frame to the bond strength of the encapsulation resin was studied. The bonding strength between the copper alloy lead frame and the resin first increases and then decreases with the increase of the oxide film thickness and reaches the maximum of 15.3 MPa at the thickness of 100 nm and 2.6 MPa higher than that before the oxidation. The reason is that the oxide film can improve the wettability with the encapsulating resin, and when the oxide film is thick, the fracture is more likely to occur in the loose oxide film, thereby reducing the bonding strength. Anti-copper stain treatment can control the bonding strength by effectively slowing the growth of oxide film.