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扩散硅力敏传感器ＣＡＤ 的技术包括３ 大部分：传感器平面工艺ＣＡＤ；传感器芯片结构ＣＡＤ；传感器结构ＣＡＤ．平面工艺ＣＡＤ 是根据半导体技术的理论，将氧化、注入、退火、再扩、腐蚀、淀积等工艺的物理模型用数学语言建立起数学模型，再利用计算机进行数值计算，使传感器芯片平面工艺流程的实验过程移植到计算机上进行，通过对工艺参数仿真计算，实现了传感器平面工艺的ＣＡＤ技术。制作传感器扩散电阻需要多个平面工艺步骤，每个工艺步骤都需要确定几个工艺参数，而任意一个工艺参数的变化都将对器件的最终特性有影响。因此在设计传感器时，平面工艺的ＣＡＤ技术将起到重要作用。扩散硅力敏传感器平面工艺ＣＡＤ是基于ＩＣＥＣＲＥＭ 软件进行的。
The proliferation of silicon force sensor CAD technology includes three major parts: sensor plane CAD; sensor chip structure CAD; sensor structure CAD. Plane process CAD is based on the theory of semiconductor technology, the oxidation, injection, annealing, re-expansion, corrosion, deposition and other physical model of the mathematical language to establish a mathematical model, and then use the computer for numerical calculation, the sensor chip planar process The experimental process was transplanted to a computer, and the CAD technology of the sensor plane process was realized through the simulation calculation of process parameters. Fabrication of sensor diffused resistors requires multiple planar process steps, each of which requires several process parameters to be determined, and any change in process parameters will have an effect on the final properties of the device. Therefore, the CAD technology of planar technology will play an important role in the design of the sensor. Diffusion silicon force sensor plane process CAD is based on ICECREM software.