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一、化学镀在电子工业中的应用 1、导电性镀层化学镀铜、化学镀镍已广泛用于ABS、聚丙烯等塑料制品上,也是功能镀中应用得最多的领域,从有关专利的数量上也说明了这一点。但随着应用的不断扩大,许多问题也随之暴露出来了。首先是镀层的内部应力以及基体与镀层的膨胀系数不同等因素使得镀层的附着力降低。目前的解决办法是对基体材料进行适当的前处理。如将聚丙烯用有机溶剂预处理后,再在铬酸—硫酸混合液中侵
First, electroless plating applications in the electronics industry 1, electroless plating Electroless copper plating, electroless nickel plating has been widely used in ABS, polypropylene and other plastic products, but also functional plating in the most areas, from the number of patents This also shows that. However, with the continuous expansion of applications, many problems have also been exposed. The first is that the internal stress of the coating and the difference between the coefficient of thermal expansion of the substrate and the coating cause the adhesion of the coating to be reduced. The current solution is to properly pretreat the substrate material. Such as the polypropylene with organic solvents pretreatment, and then chromic acid - sulfuric acid mixture invasion