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利用硅压阻传感器实时原位地记录粘接剂固化过程中的应力变化和残余应力的分布状况 ,以及在热处理过程中应力的演化过程 .研究表明 ,若粘合剂固化后在空气中储存 2 0天 ,应力将在后续热处理过程中急剧增加 ;而固化后接着经历峰值为 15 0℃左右的热处理过程 ,则可以使残余应力稳定在一个相对低的值 .
The silicon piezoresistive sensor was used to record in situ the distribution of stress and residual stress during the curing process and the evolution of stress during the heat treatment.The results show that if the adhesive cured in air after storage 2 0 days, the stress will increase sharply during the subsequent heat treatment. However, after curing followed by a heat treatment with a peak value of about 150 ℃, the residual stress can be stabilized at a relatively low value.